Doped with optimum amount of antioxidant in special manufacturing process could eliminate solder dross generated rapidly during soldering process. For wide range of electronic application such as wave soldering application, and dipping solder.
| SOLDER BAR | |||||
|---|---|---|---|---|---|
| Alloy Type | Category | Alloy Composition | Melting Point Temperature oC | Features | |
| SI100C | Lead Free | Sn R, Cu 0,7%, Ni, Ge | 227 | Low Dross Solder Bar | |
| SAC305 | Sn R, Ag 3%, Cu 0,5% | 216 - 228 | |||
| SAC0307 | Sn R, Ag 0,3%, Cu 0,7% | 217 - 219 | |||
| 63/37 | Leaded | Sn 63%, Pb 37% | 183 | ||
| 60/40 | Sn 60%, Pb 40% | 183 - 190 | |||