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| | Category: Main/5. Materials and chemicals for soldering and PCBA assembly/ 5.1. Solder paste and related parts for PCBA assembly
| | | | ◊ Đặc điểm chính: | | Inventec has been developing, since more than 25 years, solder pastes which meet the production characteristics and reliability requests of its customers. With its references in industrial High Tech markets, in the automotive, military, aeronautics fields, Inventec proposes a wide and complete range of ECORELTM and SOLDERELTM solder pastes with metallurgic, physical and chemical features.
Với bề dày hơn 25 năm phát triển các sản phẩm kem hàn, các sản phẩm kem hàn của Inventec đã đáp ứng các yêu cầu về độ tin cậy và đặc tính trong sản xuất của khách hàng. Với các tài liệu tham khảo trong các thị trường công nghiệp Công nghệ Cao như xe cơ giới (automotive), quân sự (military) và hàng không (aeronautics), Inventec đề xuất một loạt các sản phẩm kem hàn ECORELTM và SOLDERELTM hoàn chỉnh về các tính năng lý, hoá và luyện kim. |
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ECORELTM solder pastes meet the increasing number of challenges in the electronics industry due to both the evolution of the technology itself, and new legislations. Halogen free, lead free, embedded technologies, hybrid assembly, miniaturization, and other requirements are covered. - Chemical reliability of residues after reflow.
- Thermal cycling performance.
- Compatibility with Conformal Coating in No Clean process.
Alternative Alloys No Clean Lead Free Solder Pastes - Sensitive components soldering
- Improved drop shock performance
More than 2 decades of experience in high reliability markets such as automotive, energy and aerospace. For our customers, having the correct choice of materials certainly contributes to increase in long term performance and to drop in maintenance costs. QUICK ECORELTM SOLDER PASTE SELECTION GUIDE
Product
Name
|
Alloy
|
Main
Features
|
Halogen
Free
|
Bono
Test
|
Squeegee printing
|
Closed Head Printing
|
Pin
in Paste
|
Packaging
|
Jar
|
Cartridge
|
Syringe
|
250 g 500 g
|
600g 1,2 kg
|
30 g
|
100 g
|
EcorelTM Free 305-21
|
SAC305
|
Chemically
inert residue, minimizing the risk of
corrosion mechanisms and leakage current Good compatibility with a large
range of conformal coating in the market Bono corrosion test compliant
|
√
|
√
|
√
|
√
|
√
|
√
|
√
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EcorelTM Free 305-16 LVD
|
SAC305
|
Ultra
low voiding percentage and reduce void size in large contact are components
|
√
|
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√
|
√
|
√
|
√
|
√
|
|
|
EcorelTM Free 305-16
|
SAC305
|
Very
good wetting on any surface finish Strong anti-graping properties Robust
assembly process for high volume Outstanding first pass yield testability Very low voiding Transparent
and colorless residue even after multiple reflow cycles
|
√
|
|
√
|
√
|
√
|
√
|
√
|
|
|
EcorelTM Free 305-6D33
|
SAC305
|
Compatible
with polyurethane and acrylic conformal coatings Bono
corrosion test compliant Very low ionic contamination
|
√
|
√
|
√
|
√
|
|
√
|
√
|
|
|
EcorelTM Free 405Y-21
|
SAC405 + dopants
|
High
mechanical reliability for high operating temperatures Thermal
cycling resistance Bono corrosion test compliant
|
√
|
√
|
√
|
√
|
√
|
√
|
√
|
|
|
EcorelTM Free 305-1-85
|
SAC305
|
Great repeatability dot by dot
|
√
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|
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|
|
√
|
√
|
EcorelTM Free HT245-16
|
SnSb8.5
|
Higher melting point than SAC alloy suitable for electronics operating close
to 200°C, hybrid
or stacking assembly including board on board
|
√
|
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√
|
|
|
√
|
√
|
|
|
EcorelTM Free JP20
|
SAC305
|
Minimum dot diameter of 0.33 mm, T5 particle size Large
process window. Easy cleanable Compatible with jet printer
|
√
|
|
|
|
|
|
|
|
√
|
EcorelTM Free FR2
|
SAC305
|
Reflow process by laser or induction
|
√
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|
|
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√
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ALTERNATIVE ALLOYS SELECTION GUIDE
Product
Name
|
Alloy
|
Main Features
|
Halogen
Free
|
Bono
Test
|
Squeegee printing
|
Dispensing
|
Pin
in Paste
|
Packaging
|
Jar
|
Cartridge
|
Syringe
|
250 g
500 g
|
600g
1,2 Kg
|
30 g
|
100 g
|
EcorelTM Free 105-16
|
SAC105Ni
|
Very
good wetting on any surface finish Strong anti-graping properties
Robust
assembly process for high volume Outstanding first pass yield testability Very low voiding
Transparent
and colorless residue even after multiple reflow cycles
|
√
|
|
√
|
|
√
|
√
|
√
|
|
|
EcorelTM Free 105-21
|
SAC105Ni
|
Chemically
inert residue, minimizing the risk of corrosion mechanisms and leakage
current
Good compatibility
with a large
range of conformal coating in the market
Bono corrosion test compliant
|
√
|
√
|
√
|
|
√
|
√
|
√
|
|
|
EcorelTM Free 007-15
|
SnCu0.7 + dopants
|
For dispensing application
Standard reflow and selective
soldering
|
√
|
|
|
√
|
|
|
|
|
√
|
EcorelTM Free 007-16
|
SnCu0.7 + dopants
|
Very Low solder void percentage Excellent visual solder joint
cosmetics
High first pass yield testability in
ICT and FP
|
√
|
|
√
|
|
√
|
√
|
√
|
|
|
EcorelTM Free 007-21
|
SnCu0.7 + dopants
|
Chemically
inert residue, minimizing the risk of corrosion mechanisms and leakage
current
Good compatibility
with a large
range of conformal coating in the market
Bono corrosion test compliant
|
√
|
√
|
√
|
|
√
|
√
|
√
|
|
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EcorelTM Free LT140-18 | SnBiAg | Recommended for temperature sensitive components Excellent solder joint strength Low energy consumption during reflow process | √ | | √ | | | | | | |
CÁC SẢN PHẨM KHÁC CÙNG NHÀ SẢN XUẤT / OTHER PRODUCTS FROM Inventec |
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OUR GLOBAL PARTNERS
Minato, Leap, SMH-Tech, Xeltek, Elnec, Conitec, DediProg, Phyton, Hilosystems, Flash Support Group, PEmicro ||Rigol, Tonghui, Copper Mountain, Transcom, APM || Atten, Zhuomao, Puhui, Neoden, Ren Thang, Genitec, Edry, UDK ||
CONDITTION AND USING TERMS
TULA Solution Co., Ltd - Công ty TNHH Giải pháp TULA
Headquater: No. 173 Group 15, Dong Anh District, Hanoi 10000, Vietnam
Head-Office: No. 6 Lane 23, Đình Thôn street, Mỹ Đình ward, Nam Từ Liêm Dist., Hà Nội, Vietnam
Tel.: +84-24.39655633, Hotline: +84-912612693, E-mail: info (at) tula.vn |